|
|
|
|
|
|
|
|
|
|
|
|
FPCB主要设备 FPCB Main Equipment | ||||
序号 | 设备名称 | 品牌 | 单位 | 目前数量 |
1 | 钻孔 machical drilling machine | 日立、大族HITACHI/HANS | 台 | 11 |
2 | 传压机vacuum lamination machine | 博可Burkle | 台 | 8 |
3 | 等离子plasma | 世峰 | 台 | 3 |
4 | 黑孔线Black hole line | 麦德美macdermid | 条 | 2 |
5 | 镀铜线Copper plating | 东威Command | 条 | 3 |
6 | 化学沉铜线PTH line | 佳辉gainford | 条 | 2 |
7 | 线路曝光机Exposure machine | BEAC、optiray Philoptics | 条 | 13 |
8 | AOI | IMPRESS、奥宝 | 套 | 15 |
9 | 快压机Quick pressure machine | 顶瑞、比昂 | 台 | 69 |
10 | 阻焊曝光机Solder mask Exposure machine | 志聖CSUN | 台 | 7 |
11 | 测试机Test machine | YAMAHA、科汇龙KHL | 台 | 47 |
12 | 电金线Electroplating gold line | 泰森 | 台 | 1 |
13 | 镍钯金线Nickel palladium and gold line | 聚晶 | 台 | 1 |
14 | 锣机routing machine | 大量TDL | 台 | 2 |
15 | 冲床Punch | 金泰丰 | 台 | 104 |
16 | 外观检查机Appearance inspecting machine | Ximage、欣中大 | 台 | 29 |
FPCB制程能力 FPCB Manufacturing Capability | ||
FPCB项目 Item | 现制程能力Production capability in process | 研发制程能力 R/D capability |
层数Layer Count | 1～6 | 7～10 |
生产板尺寸（最小/**）(m m)Production size(Min & Max) | 250×40 / 710×250 | 250×140 / 1000×610 |
基材铜厚(oz)Copper thickness of lamination | 1/3 ～ 1 | 1/4 ～ 3 |
生产板厚度(m m)Product board thickness | 0.036 ～ 2.5 | 0.036 ～ 4 |
自动开料精度(m m)Auto-cutting accuracy | ±0.1 | |
钻孔孔径（最小/**/孔径公差）(m m) Drill size(Min/Max/hole size tolerance) | 0.075/ 6.5 / ±0.025 | 0.05 / 6.5 / ±0.025 |
CNC钻槽长度与宽度最少比 Min percent for CNC slot length and width | 2:01:00 | |
孔电镀纵横比maximum aspect Ratio (thickness/hole diameter) | 8:01 | 10:01 |
镀铜均匀性: Homogeneity of Plating Cu | ≥90% | ≥93% |
图形对图形精度(mil)Accuracy of pattern to pattern | ±3mil ( ±0.075mm) | ±2mil ( ±0.05mm ) |
图形对孔位精度(mil)Accuracy of pattern to hole | ±4mil ( ±0.1mm ) | ±2mil ( ±0.05mm ) |
最小线宽/线距(m m)Min line width/space | 0.045 /0.045 | 0.03 / 0.04 |
蚀刻公差(%)Etching tolerance | ±20％(最小公差±0.02mm) | ±15％(最小公差±0.015mm) |
覆盖膜对位公差(mil)Cover layer alignment tolerance | ±6mil (±0.1 mm) | ±3mil(±0.075 mm) |
层压覆盖膜溢胶公差（m m) Excessive adhesive tolerance for pressing C/L | 0.1 | 0.075 |
热固化油墨/UV油墨位置公差(m m) Alignment tolerance for thermosetting S/M and UV S/M | ±0.3 | ±0.2 |
最小绿油桥(m m)Min S/M bridge | 0.1 | 0.075 |
绿油到PAD/绿油到SMT（感光）最小距离(m m) Min space for S/M to pad, to SMT | 0.075 / 0. 1 | 0.05 / 0.075 |
字符到PAD/到SMT最小间距(m m) Min space for legend to pad/ to SMT | 0.2 / 0.2 | 0.15 / 0.15 |
焊盘镀镍/金/锡/OSP厚度（u m) Surface treatment thickness for Ni/Au/Sn/OSP | 1～6 /0.05～0.76 /4～20/ 1 | |
最小电测试焊盘(mil)Min size E- tested pad | 8 X 8 | 4 X 4 |
最小电测焊盘距离(mil)Min space between tested pads | 8 | 4 |
外形尺寸最小公差（边到线）(m m)Min dimention tolerance of outline (outside edge to circuit) | ±0.1 | 0.075 |
外形尺寸最小公差(m m)Min dimention tolerance of outline | ±0.1 | 0.075 |
外形最小R角半径（内圆角）(m m)Min R corner radius of outline (Inner filleted corner) | 0.2 | 0.075 |
金手指到外形边距离(m m) Min space golden finger to outline | 0.075 | 0.05 |
|
|